Methods and systems for positioning micro elements

ABSTRACT

A micro device may comprise a substrate, a first micro structure coupled to the substrate, a second micro structure coupled to the substrate, and port configured to receive an input. The first micro structure is configured to move into engagement with the second micro structure in response to the input.

CLAIM OF PRIORITY

This divisional application claims the benefit of priority under 35 USC§121 to U.S. patent application Ser. No. 11/757,343, filed on Jun. 1,2007, to be Issued on Mar. 13, 2012; which claims priority under 35 USC119(e) to U.S. Patent Application Ser. No. 60/810,666, filed on Jun. 2,2006, the entire contents of which are hereby incorporated by reference.

FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

The U.S. Government may have certain rights in this invention pursuantto Contract No. DE-AC04-94AL85000 awarded by the U.S. Department ofEnergy.

TECHNICAL FIELD

This invention relates to microelectromechanical systems (MEMS), andmore particularly to methods and systems for positioning micro elements.

BACKGROUND

MicroElectroMechanical Systems (MEMS) integrate mechanical elements,sensors, actuators, and/or electronics on a common silicon substratethrough microfabrication technology. The electronics are oftenfabricated rising integrated circuit (IC) process sequences. Themicromechanical components are often fabricated using compatiblemicromachining processes that selectively etch away parts of the siliconwafer or add new structural layers to form the mechanical andelectromechanical devices.

MEMS devices generally range in size from a micrometer (a millionth of ameter) to a millimeter (thousandth of a meter). Common applicationsinclude: inkjet printers that use piezo-electrics or bubble ejection todeposit ink on paper, accelerometers in cars for airbag deployment incollisions, gyroscopes in cars to detect yaw and deploy a roll over baror trigger dynamic stability control, pressure sensors for car tirepressure, disposable blood pressure sensors, displays based on digitallight processing (DLP) technology that has on a chip surface severalhundred thousand micro mirrors and optical switching technology for datacommunications.

SUMMARY

Methods and system's for micro machines are provided. In accordance withone aspect of the disclosure, a micro device may comprise a substrate, afirst micro structure coupled to the substrate, a second micro structurecoupled to the substrate, and port configured to receive an input. Thefirst micro structure is configured to move into engagement with thesecond micro structure in response to the input.

Post assembly and other post fabrication methods may be used to deploysurface micro machined MEMS devices with in-plane shafts and/orout-of-plane hubs, bearings, wheels, disks, gears, any structures ordevices of various kinds and the like. For example, out-of-planebearings may be constructed that hold and contain in-plane (i.e.,horizontal) rotating shafts whose cross-sections have the dimensions ofthe thin film layer thicknesses (e.g. 1 micron).

In accordance with the different aspects of the disclosure, a micromachine may be one to two orders of magnitude smaller than similardevices developed by other technologies. The micro-machine may include amicro shaft driven by a micro actuator. A micro transmission may receivein-plane reciprocating motion from the micro actuator and transmitin-plane rotational motion to the micro shaft, receive out-of-planerotational motion from the micro actuator and transmit in-planereciprocating motion to the micro shaft, receive out-of-plane rotationalmotion from the micro actuator and transmit in-plane rotational motionto the micro shaft For example, the micro transmission can be use inconjunction with existing micro actuators to drive/rotate in-planeshafts or two micro transmissions can be coupled and use in conjunctionwith existing torsional ratcheting actuators (TRA's) to drive/rotatein-plane shafts. The micro transmissions may allow for advantages to begained in driving in-plane shafts by various kinds of micro or MEMSactuators. In certain embodiments, advantages of using a micro enginemay be lower power requirements and far higher drive frequency rates. Insome embodiments, an advantage of using a thermal actuator is that itmay provide 100 to 1000 times more force than that of the micro engine.Another advantage may be that its footprint on chip is more than ten(10) times less than that of the micro engine. In some otherembodiments, an advantage of using a TRA actuator is that it can turnthe horizontal shafts incrementally “degree-by-degree” via itsratcheting mechanism.

The shaft may be horizontal and sized in or less than the micrometerdomain. A micro bearing may support rotation of the micro shaft. Themicro bearing may include multiple components each be rotatable from afirst orientation in-plane with the substrate to a second orientationout-of-plane with the substrate to engage the shaft. A tool may becoupled to the micro shaft and perform work in response to motion of themicro shaft. In the micro machine, or device, micro structures may bemoved into engagement with other micro structure in response to inputs.

The micro machine may be a micro rotary machine such as a micro blenderincluding a tool with a plurality of teeth or a micro transport machineincluding a plurality of micro wheels rotatable about a micro axle. Forexample, a micro blender may comprise a MEMS device with a 2.25 micronsquare shaft for lysing cells mechanically to remove subcellularelements (e.g., genetic material). The micro blender may have one (1)micron size cutters on its end, extending into a micro fluidic channel,for lysing cells, for cutting-up various kinds of objects, or forshaving-off material in the making of products such as pharmaceuticaldrugs. As another example, a micro vehicle may comprise a MEMS microvehicle with wheels the size of red blood cells for performing roboticmultitasking functions on chip. Other suitable micro machines may beconstructed.

The details of one or more embodiments of the invention are set forth inthe accompanying drawings and the description below. Other features,objects, and advantages of the invention will be apparent from thedescription and drawings, and from the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 illustrates a micro machine in accordance with one embodiment ofthe disclosure;

FIGS. 2A-H illustrate a micro blender machine in accordance with oneembodiment of the disclosure;

FIGS. 3A-E illustrate a micro vehicle machine in accordance with oneembodiment of the disclosure;

FIGS. 4A-D illustrate micro activators for a micro machine in accordancewith several embodiments of the disclosure;

FIGS. 5A-E illustrate micro transmissions for a micro machine inaccordance with several embodiments of the disclosure;

FIG. 6 illustrates a method of manufacturing a micro machine inaccordance with one embodiment of the disclosure;

FIGS. 7A-C illustrate a post assembly cross-system method in accordancewith one embodiment of the disclosure;

FIGS. 8A-B illustrate a post assembly tweezer-system method inaccordance with one embodiment of the disclosure; and

FIGS. 9A-C further illustrate post assembly of a bearing in accordancewith one embodiment of the disclosure; and

FIG. 10 illustrates a post assembly jacking system in accordance withone embodiment of the disclosure.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

FIG. 1 illustrates one embodiment of a micro machine 2. The micromachine 2 is a miniaturized complex system or device with a diverse setof electrical and/or mechanical functions integrated into a smallpackage, such as a chip. The chip may be, for example, a flip-chip orother suitable chip. The micro machine 2 may transmit, transform and/ormodify energy to perform or assist in performing a task. Example micromachines 2 include micro lyser, micro blenders, micro mixers, microgrinders, micro vehicles, micro generators, micro motors, micro needles,micro drills, and micro transporters.

The micro machine 2 may be sized in the millimeter, micrometer (micron),submicron (for example nanometer) or other suitable domain. In the micromachine 2, one or more components and/or features of components aresized in the micron or submicron domain. Such features may comprise thelength, diameter or other suitable dimension of a component. The micromachine 2 may comprise a Micro Electromechanical System (MEMS), alsoknown as a MicroSystem. In a particular embodiment, the MEMS micromachine 2 may have features 1-100 microns in size. In other embodiments,a micro machine 2 may be sized in the centimeter domain, particularly inlength. The micro machine may be a 3D MEMS machine with elementsextending above fabricated position or moved out of plane.

Referring to FIG. 1, the micro machine 2 includes fixed and movablestructures or elements fabricated as part of an integrated circuit (IC)or otherwise on a substrate 4. In the illustrated embodiment, the micromachine 2 includes a micro shaft 10, one or more micro bearings 12 forthe shaft 10, a micro actuator 14 for driving the shaft 10 (or otherpart of the micro machine 2), a micro transmission 16 coupling theactuator 14 to the shaft 10 and a micro tool 18 driven by the shaft 10for performing work. The micro shaft 10 with the micro bearings 12 mayform a micro drive assembly.

The micro machine 2 may also include a micro sensor 20 to gatherinformation from the environment. A micro processor 22 may process theinformation derived from the sensor 20 and control operation of themicro machine 2 as well as receive and transmit command, control, anddata communications. Miniaturized power systems 24 can be mated tosensors 20, actuators 14, and micro processor 22.

In some embodiments, the micro machine 2 may include fewer, additional,or different components and may include even multiple micro shafts 10.For example, one or more of the shaft 10, bearings 12, actuator 14,transmission 16, sensor 20, or processor 22 may be omitted. The micromachine 2 may be fixed to the substrate 4, movable on the substrate 4and/or separable from the substrate 4. In addition, one or more of thecomponents may be fabricated or reside on a separate substrate or beomitted.

The shaft 10 is an elongated bar, other element or set of elements thatmay, for example, rotate, otherwise move or transmit power. The shaft 10may be a horizontal shaft patterned or otherwise fabricated in-planewith the substrate 4. In one embodiment, the shaft 10 may have a squarecross section and may, for example, be one, two, or more microns insize. In other embodiments, the shaft 10 may, for example, have a roundor rounded cross section and/or be of a submicron size. Also, the shaft10 may, for example, be 100s of microns in length. For an integrated,circuit embodiment, the shaft 10 may be formed from a thin film ofconductor, semiconductor or dielectric material. For example, the shaft10 may comprise polysilicon, nitride, oxide, and/or a metal such ascopper, titanium, and the like.

The bearings 12 support, guide and/or reduce friction of motion for amoving part. The bearings 12 may support the shaft 10 for repeatedrelative movement between the shaft 10 and the bearings 12. As describedin more detail below, the bearings 12 may each comprise an apertureopening sized to receive the shaft 10 and to allow rotation or otherrelative movement of the shaft 10 therein. The aperture may be round,rounded or otherwise suitable shaped and may have tight tolerance withthe shaft 10. As also described in more detail below, each bearing 12may comprise an upper half and a lower half patterned in-plane with thesubstrate 4. In this embodiment, the bearing 12 may be assembled postfabrication by rotating or otherwise moving the upper and lower halvesout-of-plane for engagement with the shaft 10 as a bearing.

The actuator 14 imparts or generates motion. For example, the actuator14 may be a motor and/or may convert electrical energy into mechanicalenergy. The actuator 14 may drive the shaft 10 directly or through thetransmission 16. In these embodiments, the actuator 14 rotates,reciprocates or otherwise moves the shaft 10. In other embodiments, theactuator 14 may drive another part of the micro machine 2 or be omitted.The actuator 14 may, for example, be a thermal actuator, anelectrostatic actuator, piezoelectric actuator, shape-memory alloyactuator, pneumatic actuator, micro engine, or torsional ratchetactuator (TRA). The actuator 14 may be electrically, mechanicallychemically, or otherwise powered.

The transmission 16 transmits power between components. For example, thetransmission 16 may be an assembly of gears and associated parts bywhich power is transmitted from an actuator to a drive shaft. Thetransmission 16 may couple or otherwise directly or indirectly connectthe actuator 14 to the shaft 10. In one embodiment, the transmission 16converts or otherwise transforms one type of motion into another type ofmotion. For example, as described in more detail below, the transmission16 may transform reciprocating motion from the actuator 14 intorotational motion for the shaft 10. In another embodiment, thetransmission 16 may transform out-of plane rotation from the actuator 14into in-plane rotation. In still other embodiments, the transmission 16may transform an initial type of motion to one or more intermediatetypes of motion and the intermediate type of motion to a final type ofmotion output for rotating the shaft 10.

The tool 18 is a device capable of performing mechanical work or othertask. As described in more detail below, the tool 18 may, for example,comprise one or more wheels, cutters, files, blades, lysers, gears,needles, separators, dividers, and transporters. The tool 18 may berotated, reciprocated or otherwise moved to perform work. In otherembodiments, the tool 18 may be fixed in place.

The sensor 20 detects and responds to a signal or stimulus. For example,the sensor 20 may gather information from a component or operation ofthe micro machine 2 through measuring mechanical, thermal, biological,chemical, optical or magnetic phenomena. Exemplary sensors 20 mayinclude micro inductors, micro circuits, micro filters/resonators, microradio frequency devices (RF), micro-chem labs, surface acoustic wave(SAW) filters, SAW resonators, SAW devices, micro-pumps, micro-fluidicsdevices, nano-sensors for detecting physical, chemical, or biomedicalsignals, piezo-resistors, piezoelectric devices, magnetic materials andcomponents, micro heaters, nano pumps, nano devices, nano materials,micro-mirrors, Micro OptoElectro Mechanical Systems (MOEMS) components,photonic lattices and components, quantum dots, and the like.

The processor 22 may be any suitable electronics or devices thatprocesses information derived from the sensor 20 and through decisionmaking capability controls the micro machine 2 (including one or morecomponents therein). For example, the processor 22 may direct theactuator 14 or other component to respond by moving, positioning,regulating, pumping, and/or filtering, thereby controlling theenvironment to achieve the desired outcome or purpose.

Miniaturized power systems 24 may comprise any suitable on-chip source.Also or instead, as described below, off-chip sources may be used.On-chip and off-chip sources may comprise, for example, a micro batteryor other micro fuel cell, a micro combustion engine, a solar cell thatcollects and/or converts light energy to electrical energy a cell thatcollects and/or converts acoustic energy such as ultra sound toelectrical energy or a cell that collects and/or convertselectromagnetic energy to electrical energy, a chemical or biologicalcell of energy that converts its energy to any form of electrical ormechanical energy. In addition, the power source, or supply, maycomprise a micro scale energy-scavenging device that draws energy fromthe environment such as vibrational energy or wind energy. Theenergy-scavenging device may also draw power from temperature gradients,human power, pressure gradients and the like.

In operation, the micro machine 2 may transmit, transform and/or modifyenergy to perform or assist in performing any suitable task at themicro, nano, sub nano, or other suitable level. Also, the micro machine2 may include, as described in more detail below, systems, duringoperation or power-up, to rotate, deploy, transform, position, cycle, orotherwise move structures and elements on-chip and/or into engagementwith the other structure and elements either on-chip or off-chip.Engagement may occur when an element is operatively or otherwisesuitable associated with another. For example, when correctly positionedwithin specified tolerances to support relative movement, communicationor signal transfer.

The micro machine 2 and components of the micro machine 2 may befabricated using any suitable processes and materials. For example, themicro machine 2 may be fabricated in ceramics, metals, polymers and/orsilicon using surface micromachining electroplating and/or moldingprocesses. Surface micromachining comprises using thin films andpatterning via photolithography on a substrate (directly on thesubstrate or on structures on the substrate). Structures may befabricated through alternate deposition and patterning of sacrificialand structural materials and connecting anchors between various layers.Specific exemplary processes include Sandia Ultra-planar Multi-levelMEMS Technology (SUMMiT V™) and Lithographic Galvanoformung undAbformung (LIGA). The SUMMiT process may comprise SUMMiT V™, a fivelayer polycrystalline surface micromachining fabrication process. Inthis process, film layer thickness may comprise, for example, 1, 2.25and 2.5 microns with greater thicknesses (e.g. 4 and 6 micron) obtainedby dimple cuts and/or sandwiching layers together using anchors.

Specific surface micromachining processes that may be used includedeposition, photolithography, etching, reactive ion etching (RIE), deepRIE (DRIE), and bulk micro machining. The deposition process depositsthin films of material. The film may have a thickness anywhere between afew nanometers to about 100 micrometer. Commonly used depositionprocesses include electroplating, sputtering, physical vapor deposition(PVD) and chemical vapor deposition (CVD).

Lithography transfers a pattern to a photosensitive material byselective exposure to a radiation source such as light. A photosensitivematerial changes in its physical properties when exposed to a radiationsource. The exposed region can then be removed or treated providing amask for the underlying substrate. Photolithography is often used withmetal deposition, wet and dry etching.

Etching processes include wet etching and dry etching. In wet etching,the material is dissolved when immersed in a chemical solution. In dryetching, the material is sputtered or dissolved using reactive ions or avapor phase etchant. Metals may be used as masks for dry and wet etchingother materials depending on the selectivity of the metal to theetchant.

In reactive ion etching (RIE), the substrate 4 is placed inside areactor in which several gases are introduced. Plasma is struck in thegas mixture using an RF power source, breaking the gas molecules intoions. The ions are accelerated towards, and reacts at, the surface ofthe material being etched, forming another gaseous material. This is thechemical part of reactive ion etching. There is also a physical partwhich is similar to the sputtering deposition process. If the ions havehigh enough energy, they can knock atoms out of the material to beetched without a chemical reaction. The balance between chemical andphysical etching may be changed to influence the anisotropy of theetching, since the chemical part is isotropic and the physical parthighly anisotropic the combination can form sidewalls that have shapesfrom rounded to vertical.

In the DRIE process, etch depths of hundreds of micrometers can beachieved with almost vertical sidewalls. The primary technology is basedon the Bosch process where two different gas compositions are alternatedin the reactor. The first gas composition creates a polymer on thesurface of the substrate, and the second gas composition etches thesubstrate. The polymer is immediately or otherwise sputtered away by thephysical part of the etching, but only on the horizontal surfaces andnot the sidewalls. Since the polymer only dissolves very slowly in thechemical part of the etching, it builds up on the sidewalls and protectsthem from etching. As a result, etching aspect ratios of 50 to 1 can beachieved. The process can be used to etch completely through a siliconsubstrate, and etch rates are 3-4 times higher than wet etching.

Bulk micromachining is similar to deep etching but uses a differentprocess to remove silicon. Bulk micromachining uses alkaline liquid orother suitable solvents, such as potassium hydroxide, to dissolvesilicon which has been left exposed by the photolithography maskingstep. The alkali solvents dissolve the silicon in a highly anisotropicway, with some crystallographic orientations dissolving up to 1000 timesfaster than others. Such an approach may be used with very specificcrystallographic orientations in the raw silicon to produce v-shapedgrooves. The surface of these grooves can be atomically smooth if theetch is carried out correctly with dimensions and angles being extremelyaccurate.

FIGS. 2-10 illustrate specific embodiments of the micro machine 2 andcomponents of micro machine 2. In particular, FIGS. 2A-H illustrate oneembodiment of micro rotary machine, a micro blender 200. FIGS. 3A-Eillustrate one embodiment of a micro transport machine, a micro vehicle300. FIGS. 4A-D illustrate several embodiments of micro actuator 14.FIGS. 5A-E illustrate several embodiments of micro transmission 16. FIG.6 illustrates one embodiment of a method for manufacturing a micromachine 2. FIGS. 7-10 illustrate other aspects and embodiments of thedisclosure. The described micro machines 2 and methods are illustrativeand any other suitable type of micro machine 2 may be made and usedwithout departing from the scope of this disclosure. In each of FIGS.2-10, where bond pads are illustrated, the bond pads may each be about100 microns square, and the rest of the elements in the same and relatedfigures may be to scale with the bond pad. The bond pads may be used topower, charge or discharge elements or otherwise.

FIGS. 2A-H illustrate one embodiment of a micro rotary machine. A microrotary machine comprises a rotating drive, such as a shaft, forperforming work. In the illustrated embodiment, the micro rotary machineis a micro blender 200. The micro blender 200 may be used for lysingcells, removing subcellular elements (e.g. genetic material), mixing atmicron levels or below, cutting-up various kinds of objects, shaving-offmaterial in the making of products such as pharmaceutical drugs and forany suitable micro fluidic or other micro application. Thus, forexample, the micro blender 200 can be used to cut up the same kind ofobjects or it could be used to cut up many different objects and mix theparts.

In the illustrated embodiment, the micro blender 200, components of themicro blender 200 and features of the components are shown at orproximate to scale. It will be understood that the size of thecomponents may be varied without departing from the scope of thedisclosure. In addition, the micro blender 200 may be otherwiseconstructed with additional, fewer or other components. For example,embodiments of the micro blender using different transmissions areillustrated in FIGS. 5A-E.

Referring to FIG. 2A, the micro blender 200 includes a micro actuator202, a micro transmission 204, a micro shaft 206, micro bearingassemblies 208, a micro tool 210 and a micro fluidic channel 212fabricated on a substrate 216. The actuator 202 drives shaft 206 via thetransmission 204. The bearings of micro bearing assemblies 208 supportrotation of the shaft 206, which drives the tool 210 in the fluidicchannel 212, which may be covered. A bearing deployment system 214 isprovided to deploy the bearings 206. The micro blender 200 may includefewer, additional, or different components. In addition, one or more ofthe components may be fabricated or reside on a separate substrate.

The actuator 202 may comprise a thermal actuator with expansion members220 extended in a slight V-configuration or are between conductive stops222. In some embodiments, the actuator 202 may comprise double or othertandem thermal actuators described in more detail in connection withFIG. 4A. In this embodiment, a transmission such as illustrated in FIG.5A may be used in place of illustrated micro transmission 204.

A transmission shuttle 226 is connected between the expansion members220 at their center. Thermal actuators could have multiple shuttles todrive multiple transmissions. In a specific embodiment, the expansionmembers 220 each comprise a series of elongated bars periodicallyinterconnected by posts. For example, the bars may be arranged in amatrix of four vertical columns and three horizontal rows of bars (threelevels with each level being four bars wide). The bars may be verticallyinterconnected by anchors to form the posts. Details of a post isillustrated in FIG. 2E.

The conductive stops 222 are connected to bond pads 224 or other ports.In response to an input such as a voltage potential placed across thebond pads 224 via a probe, circuit lead, circuit lead of circuit leadframe, or other device current flows across and heats up the expansionmembers 220. The heat causes the expansion members 220 to thermallyexpand and buckle at the transmission shuttle 226 in the direction ofthe configured V due to their confinement by the conductive stops 222.The transmission shuttle 226 is driven by the buckling of expansionmembers 220.

In operation, the transmission shuttle 226 is driven in reciprocatingmotion with the buckling and unbuckling of the V-shaped expansionmembers 220. In a specific embodiment, the voltage potential may beeight volts at or less than 20 milliamps. In this embodiment, thethermal actuator 202 may operate at one kilohertz (KHz), which producesa shaft rotation of 500 revolutions per minute (RPM's). Other suitablevoltages and/or rotational speeds may be used. Also, in a specificembodiment, the reciprocating motion may be twelve (12) microns inlength. An additional bond pad 225 may be provided for discharging thesubstrate 216.

Referring to FIG. 2B, the transmission 204 includes the transmissionshuttle 226 (which extends from the thermal actuator 202) disposedbetween guides 230. A counter rotational stop 234 may also be provided.The transmission shuttle 226 includes upper and lower wedges 228disposed above and below a drive end of the shaft 206. The drive end ofthe shaft 206 includes offset cranking columns 232. In the illustratedembodiment, the cranking columns 232 are offset ninety (90) degrees.Accordingly, at least one cranking column 232 is in a verticalorientation for each movement of the transmission shuttle 226. Dimplesare used in the shuttle to reduce friction as it moves back and forthand to limit its vertical movement to nanometers tolerance.

In operation, the upper and lower wedges 228 move with the rest of thetransmission shuttle 226 in reciprocating motion (laterally back andforth) between the guides 230. During forward movement of thetransmission shuttle 226 in a first direction, the upper and lowerwedges 228 engage the then vertically oriented cranking column 232 andturn it 90 degrees from a vertical, orientation, to a horizontalorientation. More specifically, the upper and lower wedges 228 pushdistal ends of vertically oriented cranking column 232 in oppositedirections to rotate the cranking column 232 and thus the shaft 90degrees. As the shaft 206 rotates, the offset cranking column 232 thatwas horizontal is turned vertical. During backward movement of thetransmission shuttle 226 in a second opposite direction, the upper andlower wedges 228 engage the then vertically oriented cranking column 232and turn it an additional 90 degrees from the vertical orientation tothe horizontal orientation. As the shaft 206 rotates, the offsetcranking column 232 that was horizontal is turned back to vertical. Inthis embodiment, one reciprocating back and forth cycle of thetransmission shuttle 226 (i.e., one reciprocating cycle of the upper andlower wedges 228) causes the shaft 206 to rotate 180 degrees. Two cyclesproduces one cycle of rotation of the shaft 206.

The drive end of the shaft 206 may include additional cranking columns232 and/or a different offset between cranking columns 232. Also, thetransmission shuttle 226 may include additional upper and lower wedges228. Thus, for example, the shaft 206 may be rotated 180 degrees by aback-and-forth movement of the transmission shuttle 226 with tworeciprocating cycles of the transmission shuttle 226 rotating the shaft206 a full revolution. The transmission shuttle 226 can be driven, forexample, by double thermal actuators connected rigidly together andconfigured with their “V-like” structures positioned in oppositedirections as well as driven by Sandia's SymmDrive Microengine. When thedouble thermal actuators are connected rigidly together in thisconfiguration, the two electric pulses that are sent to them are offsetin a slight time delay to allow for their buckling to act in the samedirection. The first thermal actuator receiving the first electric pulsedetermines the direction of motion; the other thermal actuator receivingthe delayed pulse will then follow and push in the same direction as thefirst. The reciprocating back-and-forth motion is obtained by reversingwhich actuator gets the first electric pulse and which gets the delayedpulse. The delayed pulse only needs to be long enough for the “V-like”structure on the second thermal actuator to reverse from one side to theother side. Since both thermal actuators are acting together in the samedirection, the amount of force achieved by this configuration is doublewhat is achievable by either of the single thermal actuators in otherconfigurations where they are not rigidly connected together. Further,the upper and lower wedges 228 may be otherwise configured such that,for example, reciprocation of the transmission shuttle 226 causes theshaft 206 to rotate back and forth 90 degrees rather than to fullyrotate.

The transmission 204 may include gears to alter rotational speed of theshaft 206 relative to reciprocal motion of the thermal actuator 202. Thegear ratio may be set to speed up or slow down shaft rotation and may befixed or dynamically adjustable in response to sensor input andprocessor control. For example, light shear/torque loads (e.g., mixinggasses) may allow for a high gear ratio while heavy shear/torque loads(e.g., mixing solids or viscous fluids, lysing cells or biomaterials)may require a low gear ratio or multiple sets of wedges 228 and crankingcolumns 232.

The counter rotational stop 234 reduces or prevents rotation of theshaft 206 in a direction opposite the drive direction. For example, aheavy and/or compressible load at the tool 210 may cause the shaft 206to torque and/or to spring back in a counter rotational direction. Thecounter rotational stop 234 reduces or prevents backward rotation suchthat the next reciprocating cycle of the transmission shuttle 226 willrotate the shaft 206 a next 90 degrees in the drive direction.

In one embodiment the counter rotational stop 234 comprises a set offour counter rotational tabs 236 fixed to the shaft 206. The counterrotational tabs 236 are each offset by 90 degrees and extend from and inalignment with the longitudinal axis of the shaft 206 to form a plussign (+) cross section. Horizontal poles 238 are elongated and engagethe counter rotational tabs 236 from each side of the shaft 206 toprevent counter rotation. More specifically, the horizontal poles 238are vertically hut not horizontally displaceable. Thus, each horizontalpole 238 allows a then horizontal counter rotational tab 236 totemporally and vertically displace the horizontal pole 238 (up or downas the case may be) as the shaft 206 rotates in the drive direction.Counter rotational tabs 236 moving counter rotationally from vertical tohorizontal will impact ends the horizontal poles 238 and thus be stoppedto prevent counter rotation of the shaft 206. Other suitable counterrotational stops 234 may be used. In additional, the counter rotationalstop 234 may be omitted.

The shaft 206 may be a unitary, continuous and/or comprise a pluralityof parts. In the illustrated embodiment, the shaft 206 is unitary andcontinuous, extending from the transmission 204 to the tool 210. In aparticular embodiment, the shaft 206 may be 100s of microns in lengthand may be a 2.25 micron square shaft. Along its length, the shaft 206may include a plurality of position tabs 240. The position tabs 240extend from and perpendicular to the longitudinal axis of the shaft 206.The position tabs 240 abut and/or face opposing position stops 242. Theposition stops 242 may be rigid or flexible. A rigid position stop 242may be fixed to and extend directly from the substrate 216. A flexibleposition stop 242 may be indirectly coupled to the substrate viaelongated poles 244 and post 246. The shaft 206 may be otherwisesuitable constructed and/or, if needed, maintained in position.

Referring to FIGS. 2C-E in connection with FIG. 2A, the micro bearingassemblies 208 are fabricated in-plane and deployed out-of-plane withthe substrate 216. The bearings of micro bearing assemblies 208 supportand reduce rotational friction for the shaft 206. In the illustratedembodiment, each micro bearing assembly 208 comprises a bearing 250 andan alignment system 256. The bearing 250 may include offset butconnected components that each include a half bearing hole 252. As usedherein, “each” means every one of at least a subset of identified items.Further information on bearing construction is described in connectionwith FIG. 9A-C.

In one embodiment, the half bearing holes 252 are rounded. In otherembodiments, the half bearing holes 252 are otherwise shaped, such asnot squared. In some embodiments, the half bearing holes may be squared.Upon deployment, the half bearing holes 252 together form a horizontallyoffset bearing hole 254 that may surround the shaft 206. For example,one half may be outwardly oriented of an upper portion of the shaft 206while a second half is inwardly oriented of a lower portion of the shaft206. The components of the bearing 250 may be interconnected by anchorsand post as previously described. In another embodiment, the each halfmay be separately deployed and/or the bearing 250 may comprise a partialhole or aperture. For example, the bearing may comprise a half hole or adeep channel.

The alignment system 256 may comprise one or more alignment grooves 258formed in the same components as the bearing 250 and correspondingalignment bars 260. Each alignment groove 258 may be V-shaped to capturethe corresponding alignment bar 260 and then pull the alignment groove258 and thus the bearing 250 into alignment during deployment. In aparticular embodiment, the alignment system 256 includes an alignmentgroove 258 and bar 260 on each side of the bearing hole 254. In this andother embodiments, the bearing may have a prescribed and “designed-in”tolerance (e.g., 100 nanometers or less). The bearing 250 may beotherwise configured and/or aligned. For example, the half bearing holes252 may be configured so that the two halves of the deployed bearing 250form a vertically oriented hole for the shaft or they may be configuredso that the two halves 252 of the deployed bearing in their verticalorientations are horizontally offset from each other with a prescribedand “designed-in” tolerance (e.g., lens of nanometers to severalmicrons). In other embodiments, the alignment system 256 or even thebearing 250 may be omitted.

The bearing deployment system 214 rotates, moves, transforms, positionsor otherwise deploys the bearings 250 into engagement with the shaft206. Engagement may occur when the bearing 250 is operatively orotherwise suitable associated with the shaft 206. For example, whencorrectly positioned within specified tolerances to support rotation ofthe shaft 206. As described above, the bearings 250 may be movedout-of-plane from a fabrication or other position to a use position.

In the illustrated embodiment, the bearing deployment system 214comprises a set of actuators 262, extension links 264, bearing locks 266and bearing rotation systems 268 that deploy the bearings 250 postfabrication. The bearing deployment system 214 may include fewer,additional, or different components. In addition, one or more of thecomponents may be fabricated or reside on a separate substrate 216.Furthermore, the bearings 250 may be otherwise suitable deployed.

The actuators 262 may be thermal actuators as described in connectionwith the actuator 202 or other suitable actuators. The extension links264 may each comprise a slide 270 disposed between guides 272. In aparticular embodiment, the slide 270 may engage a groove or channel inthe guide 272 to, for example, reduce or prevent vertical, movement ofthe slide 270 and/or to facilitate lateral movement of the slide 270during bearing 208 deployment. As above, dimples may be used on theslide 270 to guide in place and to reduce friction as it moves.

The bearing locks 266 each reduce or prevent backward movement of theassociated slide 270 after bearing 250 deployment. In the illustratedembodiment, the bearing locks 266 comprise one or more sets of teethbiased into engagement that allow the slide 270 to move outwardly awayfrom the shaft 206 for deployment but that prevent inward movement ofthe slide 270. A more detailed view of a bearing lock is illustrated inFIG. 5A. The bearing locks 266 may be otherwise configured or omitted.

The bearing rotation systems 268 deploy the bearings 250 in response tooutward movement of the extension links 264 and thus the actuators 262(i.e., on-chip actuation). Each bearing rotation system 268 may comprisea X-crank system 274 connected or otherwise coupled to the opposingextension links 264. The X-crank system 274 includes upper and lowerwedges 276 disposed above and below a bearing extension with crankingcolumns 278. In the illustrated embodiment, the cranking columns 278 arein a vertical orientation after fabrication and before bearing 250deployment.

The X-crank system 274 moves with the thermal actuators 262 andextension links 264. During outward movement of the X-crank system 274,the upper and lower wedges 276 engage the then vertically orientedcranking column 278 and turn it ninety (90) degrees from a verticalorientation to a horizontal orientation. More specifically, the upperand lower wedges 276 push distal ends of vertically oriented crankingcolumn 278 in opposite directions to rotate the cranking column 278 andthus the bearing ninety (90) degrees.

For deployment, a voltage potential input via a probe, circuit lead,circuit lead of circuit lead frame or other device is applied acrossports or pads 265 of the expansion members of the thermal actuators 262(i.e., on-chip actuation). In response to thermal expansion, theexpansion members pull on the extension links 264 to deploy bearings 250with a ninety (90) degree rotation into final position as shown in FIG.2D. As used herein, an action “in response to” an event means that theaction occurs at least in response to the event. Thus, other actions maybe needed, desired, and/or intervene. During the ninety (90) degreeturn, the alignment system 256 governs the precise 3-D positioning ofthe bearings 250 about the shaft 206 as shown by FIGS. 2C-E. The bearinglocks 266 hold the extension links 264 fixed at their extended position.

Referring to FIG. 2F in connection with FIG. 2A, the tool 210 isattached to and driven by the shaft 206. The shaft 206 and tool 210 mayrotate together as one continuous unit. In other embodiments, the tool210 may be driven by a transmission or gear that in turn is driven bythe shaft 206 or otherwise. As previously described, the shaft 206, andthus the tool 210, may rotate at 500 RPM's or other suitable rotationalspeeds.

The tool 210 is disposed in the fluidic channel 212. In the illustratedembodiment, the tool 210 comprises a bank of teeth, or micro blades, 280forming a cutter 285. In this embodiment, the tool 210 lyses cells(i.e., breaks through the cells' membrane for removal of cell innerparts including DNA) flowing in the fluidic channel 212 from an inlet282 to an outlet 284 as shown in FIG. 2H. The inlet 282 and outlet 284may be DRIE cut as described above.

Stops 286 may be located in micro fluidic channel 212 provideconfinement regions 288 between tool 210 and stops 286 for assisting inthe cell lysing process. After cells are lysed by tool 210, the lysedparts flow through fluidic channel 212 to the outlet 284. The microblender 200 may be used for lysing other artifacts and/or for mixing orother suitable applications. In addition, a plurality of cutters/mixersmay be used. For example, counter-rotating/counter-moving or fixedbladed shafts with cutters/mixers may be configured with horizontal andor vertical offset relative to moving tool 210 and work in conjunctionwith each other to aid in lysing, cutting, shearing, grinding, mixing,and the like. In these embodiments, a single shaft 206 or multipleshafts 206 may drive the plurality of tools or tool elements.

Referring to FIGS. 2G-1 and 2G-2, a cross sections of the channel 212 atthe cutter 285 is illustrated. In this embodiment, the teeth, or blades,280 are about one (1) micron and the shaft is about two (2) micronssquare. A cover 290 covers the micro fluidic channel 212 and extendsdown between teeth 280. The top of the cover 290 may be ten (10) micronsfrom the substrate 216. The micro fluidic channel 212 may be, forexample, as little as six (6) microns high. The cover 290 may be anitride or other suitable layer deposited over a sacrificial layerfilling the channel 212 during fabrication or may be plastic or othersuitable material bonded to top of micro fluidic channel 212. In thedeposition embodiment, the sacrificial layer may be etched from themicro fluidic channel 212 through inlet 282 and 284 as well as throughan opening where the shaft 206 enters the micro fluidic channel 212. Inthe bonding embodiment, a rectangular structure 298, as shown in FIG.2A, may be used to support the cover 290.

Referring to FIG. 2H, the micro blender 200 implemented as a MEMS chip292 is illustrated. In this embodiment, the micro blender 200 isfabricated in thin films on a chip 294. The chip 294 may be about six(6) mm by three (3) mm in size. On the chip 294, the micro actuator 202,micro transmission 204, micro shaft 206, micro bearing assembly 208 andother components may be implemented in a drive section 296 abutting themicro fluidic channel 212 extending between inlet 282 and outlet 284.The in-plane horizontal shaft (horizontal with respect to the chipssubstrate) may, in some embodiments, use a substantial amount of realestate in the plane of the substrate 294 and may allow the micro blender200 to be fabricated in 10 microns elevation on the substrate 294.

The micro blender 200 may be fabricated using the SUMMiT V™ fabricationprocess, which is a five-layer polycrystalline silicon surfacemicromachining process (the P0 ground plane/electrical interconnectlayer and the four mechanical/structural layers P1 through P4). SUMMiTV™ alternately deposits a film, photolithographically patterning thefilm, and then performs chemical etching. By repeating this process withlayers of silicon dioxide and polycrystalline silicon, extremelycomplex, inter-connected three-dimensional shapes can be formed. Thephotolithographic patterning is achieved with a series oftwo-dimensional “masks” that define the patterns to be etched. TheSUMMiT V™ process uses 14 individual masks in the process, approximatelythe same quantity as in many CMOS IC processes.

For the SUMMiT V™ process, a single-crystal silicon wafer may be used.The wafer may be N-type for compatibility with poly doping. The wafermay be CZ (Czochralski) grown with a polished surface. One or morelayers of sacrificial oxide may be used between mechanical/structurallayers. Sacrificial oxide may be deposited on silicon in diffusionfurnaces with oxygen, dry or steam (wet), at temperatures of 850-1150°C. Thermal oxidation of silicon may generate compression stress asthermal expansion difference and silicon dioxide takes more volume thansilicon. The sacrificial oxide may be patterned using photoresist, whichmay be spun on. Resist thickness may, for example, be 0.5-5.0 microns.Thinner resist may be used for defining finer features of the micromachine 2. A sensitizer may be used to prevent dissolution of unexposedresist during development. The photoresist may be exposed to lightthrough a dark field mask. The light, for example, 200-450 nano meters(nm), breaks the sensitizer, causing exposed regions to dissolve in thedeveloper solution.

An oxide etch may be used to etch any oxide not protected by thephotoresist. The etch may be wet or dry and isotropic or anisotropic.For example, a wet oxide etch may be a hydrofluoric (HF) etch. A dryoxide etch may be fluorine based chemistry such as CHF₃ or C₂F₆. Otheretches may be a sputtering ion etch, a chemical plasma etch, anion-enhanced energetic plasma etch, or an ion-enhanced inhibitor etch.In one embodiment, the etch is selected based on the desired sidewallprofile. A post etch may be used to remove or strip photoresist usingplasma and/or solvent.

The mechanical/structural layers may be deposited layers of polysilicon.Conformal deposition may coat the underlying topography and provide stepcoverage. The polysilicon may be doped in-situ, using phosphine (PH₃)for N-type or diborane (B₂H₆) for P-type. Silicon deposition may, forexample, be low-pressure chemical vapor deposition (LPCVD (poly)) orplasma enhanced chemical vapor deposition PECVD (amorphous). LPCVDsilane pyrolysis may typically be at 550-700° C. Below 600° the film isamorphous.

Deposited layers may be annealed. Typically, if annealed at 900° C. orabove, stress relaxation occurs. Light sensitive photoresist may be spunon as described above. A clear field mask may be used to exposephotoresist to light using a polysilicon mask. As above, resist inexposed regions dissolves in the developer solution as light breaks downthe sensitizer in the resist.

A silicon etch etches away polysilicon not protected by photoresist. Theresist protects the defined regions during etch. The silicon etch may bewet or dry. Dry silicon etch may be, for example, fluorine basedchemistry such as SF₆ or C₄F₈. A deep reactive etch may be used for highaspect ratios. As above, the etch may be selected based on side wallprofile. As also above, the photoresist may be removed by a post etch asdescribed above.

This process of deposition and etching sacrificial and structural layersmay be repeated any number of suitable times. Sacrificial oxide may, inone embodiment, be etched away to release movable structures andcomplete processing. A wet HF based chemistry etch may be used forrelease. Release is further described below in connection with FIG. 6.

In one SUMMiT V™ embodiment of the micro blender 200, the shaft 206 andtool 210 are fabricated using the P3 mechanical/structural layer, thebearing components and the upper and lower wedges 276 are fabricatedusing the P1/P2 mechanical/structural layer and the P4mechanical/structural layer, and the cranking columns 278 are fabricatedusing the P1, P2, P3, and P4 mechanical/structural layers. In otherembodiments, the shaft 206 and tool 210 may be fabricated using the P2mechanical/structural layer, the bearing components 250 and the upperand lower wedges 276 may be fabricated using the P1mechanical/structural layer and the P3 mechanical/structural layer, andthe cranking columns 278 may be fabricated using the P1, P2, and P3mechanical/structural layers. The structural layers may, in oneembodiment, be separated by about two (2) microns. In still otherembodiments, the shaft 206, tool 210, and other components of the microblender 200 may be fabricated using nitride layers and/or othermaterials used in the semiconductor industry in addition topolycrystalline silicon layers.

Other suitable processes can be used to fabricate the micro blender 200or various parts of the micro blender 200. For example, the SandiaNational Laboratories' SwIFT™ process may also be used. The SwIFT™process uses nitride layers in addition to the SUMMiT V™ fabricationprocess. The SUMMiT V™, SwIFT™, various LIGA processes and otherprocesses can be used to fabricate any embodiment of the micro machine 2or various parts of the micro machine 2.

FIGS. 3A-E illustrate one embodiment of a micro transport machine. Atransport machine is powered to itself move and/or elements or materialin performing tasks. The micro transport machine may have any suitabledrive component and may be driven and steered using any suitablewireless power source such as electro-magnetic fields. In thisembodiment drive component may be magnet. In other embodiments, thedrive component may be a material or device responsive to a drive signalor energy.

The micro transport machine may not be tethered, may be free ranging,may be steerable to any area on or off the substrate and/or may move in3D to different levels of the substrate as well as off the substrate. Inthe illustrated embodiment, the micro transport machine is a microvehicle 300. Micro vehicle 300 may be used for transporting materials ona chip, performing general robotic functions at micro levels, and othersuitable applications.

Referring to FIG. 3A, the micro vehicle 300 in its fully deployed formincludes vertically oriented wheel 302, wheel axle 304, bumpers 306,space for magnet 308, 3-D positioning and guide system 310, body axle312, locking system 320, and cranking pins 340 for deploying microvehicle 300. The micro vehicle 300 may include additional or othercomponents. In addition, one or more of the components may be fabricatedor reside on a separate substrate or be omitted.

The body axle 312 extends from front to back on both sides of themicro-vehicle 300. As shown in FIG. 3C, the body axle 312 compriseswheels 302, wheel axle 304, guide pin 314 of 3-D positioning system 310,locking pin 316 of locking system 320, and cranking pin 340. As shown inFIG. 3A, magnetic material can be prefabricated on the bed ofmicro-vehicle in the space for magnetic material 308 or, alternately, itmay be welded onto the bed in space 308 after fabrication and release byusing specialized tools in a scanning electron microscope (SEM) machine.

Referring to FIG. 3B, the micro vehicle machine 300 in its pre-deployedform includes horizontally oriented wheels 302, axles 304, bumpers 306,space for magnet 308, 3-D positioning and guide system 310, body axle312, locking system 320, and cranking pins 340 for deploying microvehicle 300. The wheels 302 with “rotatable rim about an axis or shaft”,as an example, could be made or configured using Sandia's pin-joint-cutlayer in SUMMiT V™. For the deployment of the wheels 302, the crankingpins 340 are turned ninety (90) degrees so that each wheel 302 is turnedninety (90) degrees from its horizontally fabricated orientation to itsvertically deployed orientation as shown in FIGS. 3A and 3C.

Referring to FIGS. 3A-B, the 3-D positioning system 310 may have aV-shaped entrance for guiding the guide pins 314 into final position.The locking system 320 may have spring-like cantilevers 322 extendingfrom the middle of the vehicle as shown in FIGS. 3A-B so that itslocking pins 316 attached to the body axle 312 may push up thespring-like cantilevers 322 and lock permanently into the slotted holes324 of locking system 320.

Referring to FIG. 3D, components similar to those used in the microblender 200 for deploying micro bearing assembly 208 may be used in thedeployment of wheels 302 and deployment of the micro vehicle 300 fromits fabricated position. In particular, such components may be, forexample, a thermal actuator, a micro bearing deployment system,extension links, and locks. As the body axle 312 is turned ninety (90)degrees as shown in FIGS. 3A and 3C, the guide pins 314 of the 3-Dpositioning system 310 and the locking pins 316 of the locking system320 center the position of the body axle 312 and its attached front andback wheels 302 in their deployed, or final, positions as shown in FIG.3A.

In a particular embodiment, micro-vehicle 300 may have wheel diametersin the range of 8-15 microns and up, wheels the size of red blood cells,widths in the range of 20-30 microns and up, and lengths in the range of40-75 microns and up. These micro-size vehicles may be used to performrobotic multitasking functions on-chip and to be driven/powered byelectrostatic, electromagnetic, electrokinetic systems/fields, or by anyother means. As shown in FIG. 3E, the micro vehicle 300 may travel on atrack 330 using traveling wave dielectrophoresis.

The SUMMiT V™, SwIFT™, and various LIGA processes and others like themcan be used to fabricate various embodiments of the micro vehicle 300.In the SUMMiT V™ fabrication embodiment of the micro vehicle 300, thewheels 302 and bumpers 306 are fabricated using the P1/P2mechanical/structural layers, the body axle 312 is fabricated using theP3 mechanical/structural layer, and the locking system 320 andspring-like cantilevers 322 are fabricated using the P1/P2mechanical/structural layer and the P4 mechanical/structural layer. Inother embodiments, the body axle 312 may be fabricated using the F2mechanical/structural layer and the locking system 320 and spring-likecantilevers 322 may be fabricated using the P1 mechanical/structurallayer and the P3 mechanical/structural layer. In still otherembodiments, the various components of the micro vehicle 300 may befabricated using nitride layers and/or other materials used in thesemiconductor industry in addition to polycrystalline silicon layers.

FIGS. 4A-D illustrate various embodiments of actuator 14. Other suitableactuators 14 may be used for the micro blender 200, micro vehicle 300,and other micro machine 2 applications.

Referring to FIG. 4A, a single thermal actuator 400 as described inconnection with micro blender 200 is illustrated. The thermal actuator400 provides reciprocating motion 402 to drive a shaft. 10, transmission16, tool 18 or other device.

Referring to FIG. 4B, a multiple thermal actuator assembly 410 isillustrated. The thermal actuators are positioned in a tandemconfiguration to create in-plane reciprocating (i.e., push and pull)motion. In a specific embodiment, the thermal actuators may be in adouble configuration with opposing V-shape structures. A first thermalactuator 412 may produce a pulling motion in first direction and asecond thermal actuator 414 may produce a pushing motion in a second,opposite direction to provide reciprocating rectilinear motion 416. Theuse of thermal actuators in a tandem configuration may mimic thepush/pull motion of a micro engine, such as Sandia's micro enginedescribed in connection with FIG. 4D.

Referring to FIG. 4C, a torsional ratcheting actuator (TRA) 420 isillustrated. As is shown, the TRA 420 provides in-plane rotationalmovement 422. The TRA 420 has a multitude of inner banks ofelectrostatic comb drive arrays 424 that ratchet an outer ring gear 426.When the comb drive arrays 424 are electrostatically actuated, they makean angular displacement that is sufficient for rotating and ratchetingthe outer ring 426 gear at least one tooth.

Referring to FIG. 4D, a micro engine 430 is illustrated. The microengine 430 may be Sandia's micro engine. In this embodiment, the microengine 430 provides reciprocating motion 432. The micro engine 430 hastwo main sets of electrostatic “comb drive” banks 434 that are attachedto a central longitudinal ram 436. When electrostatically actuated, oneset is used to drive the ram 436 in the forward direction and the otherset is used to drive the ram 436 in the reverse direction.

Advantages of using actuators 400 and 410 instead of a micro engine 430or TRA 420 may be twofold. First, the single and double thermal actuatorsystem 400 and 410 may have a chip footprint that is less than tenpercent that of the micro engine 430. For example, the double thermalactuator system 410 may have a footprint of one (1) millimeter by 100microns. Second, the double thermal actuator system 410 provides onehundred (100) to one thousand (1000) times more force than that of themicro engine 430. For example, the double thermal actuator system 410may provide millinewtons of force. Advantages of using the micro engine430 instead of actuators 400 and 410 may include lower powerrequirements and far higher drive frequency rates as a thermal actuatoris limited to about one thousand (1000) Hz. Advantage of using a TRA 420may include that it can turn the horizontal shaft 10 incrementally“degree-by-degree” via its ratcheting mechanism.

FIGS. 5A-E illustrate various embodiments of the micro transmission 16.The micro transmission 16 transmits power between components such asfrom a thermal actuator or other micro actuator 14 to a horizontalrotating shaft 206, other drive shaft or device. The micro transmission16 may convert or otherwise transfer one type of motion into a differenttype of motion. The micro transmission may include an input shaftcoupled to the micro actuator 14 and an output shaft coupled to themicro shaft 10. The input and output shafts may include gears, slides,pins and the like. One or more power conversion elements convert a firsttype of movement, or motion, from the input shaft to a second differenttype of movement, or motion for the output shaft. Other suitable typesof micro transmissions 16 may be used. For example, the microtransmission 204 illustrated in connection with the micro blender 200may be used for any suitable application.

FIGS. 5A-B illustrate one embodiment of a micro transmission 500 forconverting in-plane (i.e., in the plane of the substrate) reciprocatingmotion 506 into in-plane (x-axis) rotational motion 508. The microtransmission 500 may be powered by double thermal actuators 502 to drivea micro shaft 505 and a micro tool 504. The micro transmission 500 maybe used for other suitable applications such as converting reciprocatingmotion in any plane, including out-of-plane, into rotational motion inthat plane.

Referring to FIG. 5A, the double thermal actuators 502 may be used tocreate in-plane reciprocating (i.e., push and pull) motion, as describedin connection with FIG. 4B. Referring to FIG. 5B, the micro transmission500 comprises cranking mechanisms 510 and 520 which includes inputshafts and power conversion elements of the transmission. Crankingmechanism 510 turns micro shaft 505 ninety (90) degrees during a pullingmotion of powered actuation. The cranking mechanism 520 turns microshaft 505 ninety (90) degrees during a pushing motion of poweredactuation. Cranking mechanism 510 comprises an upper wedge 512, a lowerwedge 514, a (illustrated as vertically oriented) cranking column 516attached to micro shaft 505, and a shuttle guide 518. Cranking mechanism520 comprises an upper wedge 522, a lower wedge 524, a (illustrated ashorizontally oriented) cranking column 526 attached to micro shaft 505,and a shuttle guide 528. The cranking columns 516 and 526 for part ofthe power conversion elements which the shaft 505 includes the outputshaft of the transmission 500. In other embodiments, the output shaftmay be distinct or non-internal with shaft 505.

In operation, the micro transmission 500 rotates micro shaft 505 anddrives micro tool 504. During a pulling motion by thermal actuator 502a, shown in FIG. 5A, the cranking mechanism 510 slides in shuttle guide518 so that wedges 512 and 514 engage cranking column 516 and turn thefollowing items ninety (90) degrees: the cranking column 516, the microshaft 505, and the cranking column 526. At the end of the pulling cycle,the cranking column 516 is turned ninety (90) degrees from a verticalorientation into a horizontal orientation and the cranking column 526 isturned ninety (90) degrees from a horizontal orientation into a verticalorientation.

During a pushing motion by thermal actuator 502 b, the crankingmechanism 520 slides between shuttle guides 518 and 528 so that wedges522 and 524 engage cranking column 526 and turn the following itemsninety (90) degrees: the cranking column 526, the micro shaft 505, andthe cranking column 516. At the end of the pushing cycle, the crankingcolumn 526 is turned ninety (90) degrees from a vertical orientationinto a horizontal orientation and the cranking column 516 is turnedninety (90) degrees from a horizontal orientation into a verticalorientation. The one cycle reciprocating action of the pulling andpushing motions on transmission 500 provides one hundred eighty (180)degrees rotation of the micro shaft 505. Two such cycles provide acomplete three hundred sixty (360) degrees rotation of shaft 505.

FIGS. 5C-E illustrate one embodiment of a micro transmission 530 forconverting out-of-plane (i.e., perpendicular to substrate) rotation 536into in-plane (x-axis) rotational motion 538 via reciprocating motion539. The micro transmission 530 may be powered by TRA 532 to drive amicro shaft 535 and a micro tool 534. Micro transmission 530 may beotherwise used for converting rotational motion to a differentrotational motion, rotational motion an intermediation or finalreciprocating motion, and other suitable applications. For example,micro transmission 530 may convert rotation in any plane, includingin-plane, into rotational motion in any other plane, includingout-of-plane.

Referring to FIG. 5C, the TRA 532 may be used to create an out-of-plane(z-axis) rotation 536 as described in connection with FIG. 4C. Referringto FIG. 5D, the micro transmission 530 comprises connected microtransmissions 540 and 550. Micro transmission 540 converts out-of-planerotation 536 into in-plane reciprocating motion 539. Micro transmission550 converts in-plane reciprocating motion 539 into in-plane rotation538 of micro shaft 535 and micro tool 534.

The micro transmission 540 comprises a gear 542 attached to a powereddevice such as TRA 532, a gear 548 driven by gear 542 of TRA 532, a pin544 attached to gear 548 that drives slider mechanism 546. Gear 548 iscomposed of slider 570 and arm 572 which are shown in FIG. 5E. Arm 572is attached via a “pin-in-slot” to gear 542 as shown in FIG. 5E. Therotating gear 542 of the micro transmission 540 converts out-of-planerotational motion 536 into in-plane reciprocating motion 539 of theslider mechanism 546.

Referring to FIG. 5E, the inner structure of the micro transmission 540is illustrated. In this embodiment, a first block 570 slides back andforth as gear 542 rotates. Slider mechanism, or block, 546 also slidesin reciprocating motion. Arm 572 is attached to blocks 546 and 570. Thedifference in distance between the points where the arm 572 attaches tothe blocks 546 and 570 determines the output magnitude of thereciprocating motion of the micro transmission 540.

Referring back to FIG. 5D, the micro transmission 550 comprises ashuttle guide 552 for slider mechanism 546, an upper wedge 554, a lowerwedge 555, a (illustrated as vertically oriented) cranking column orpin, 556, and a (illustrated as horizontally oriented) cranking columnpin 558. In operation, during reciprocating motion of the slidermechanism 546 in the shuttle guide 552, the wedges 554 and 555 engageand turn the pins 556 and 558 ninety (90) degrees and then anotherninety (90) degrees in a two-sequence one hundred eighty (180) degreescycle. Two such cycles provide a complete three hundred sixty (360)degrees rotation of shaft 535 and tool 534.

In the SUMMiT V™ embodiment, the micro transmission 540 may have the armfabricated in the P3 layer, the slider mechanism 546 in the P4 layer,and the block 570 in the P2 layer. The micro transmission 540 may beotherwise suitably constructed,

FIG. 6 illustrates a method for manufacturing the micro machine 2 inaccordance with one embodiment of the disclosure. In this embodiment,the micro machine 2 is an integrated on-chip, or single substrate,system such as the micro blender 200 or the micro vehicle 300. The micromachine 2 may be otherwise suitably manufactured.

Referring to FIG. 6, the method begins at step 600 in which the micromachine 2 is fabricated. As described above, the micro machine 2 may befabricated using suitable processes and materials. For example, themicro machine 2 may be fabricated in ceramics, metals, polymers and/orsilicon using surface micromachining electroplating and/or moldingprocesses. Surface micromachining comprises fabrication of structuresusing thin films and patterning via photolithography. Surface micromachining may fabricate structures through alternate deposition andpatterning of sacrificial and structural materials. Specific exemplaryprocesses include SUMMiT V™ and LIGA.

Proceeding to step 602, parts, or structures, of the fabricated micromachine 2 are released. In one embodiment, sacrificial material isremoved to release moving parts that were supported or held immobile bythe sacrificial material. The moving parts may be, for example, flexibleor cantilever style arms, shafts, bearings, hubs, wheels, disks, gears,or other structures. In the SUMMiT V™ fabrication process, thesacrificial material may comprise sacrificial oxide and release a wetetch in HF based chemistry to complete processing.

At step 604, post assembly methods construct of out-of-plane featuresusing parts patterned in-plane and released. The post assembly methodsmay comprise direct (by turning) or other rotation of structures, suchas pins, arms, bearings, shafts, columns, cylinders and/or groovesin-plane from in-plane to out-of-plane, from out-of-plane to in-planeand/or between different orientations. Precise positioning in 3-Dcoordinates for such out-of-plane features may be provided by the postassembly methods. For example, alignment, 3-D positioning and/or guidesystems, such as those described in connection with the micro blender200 and micro vehicle 300 may be provided.

Post assembly uses on-chip actuation, such as MEMS actuators, to rotateor otherwise move structures. In one embodiment, structures patternedin-plane are rotated ninety (90) degrees into an out-of-planeorientation. The post assembly method may comprises the “cross-system”described above in connection with FIGS. 2A-H and below in connectionwith FIGS. 7A-C, the “tweezers-system” described above in connectionwith FIGS. 3A-E and below in connection with FIGS. 8A-B, or othersuitable system for rotating in-plane patterned structures intoout-of-plane structures or otherwise constructing of features usingparts that are patterned in-plane. The post assembly methods may alsoreceive and rotate a separately constructed device from out-of-plane toin-plane or otherwise. The post assembly methods provide development andconstruction of new kinds of micro-machinery (e.g., those that userotating shafts in the plane of the substrate and/or use out-of-planeobjects such as wheels).

FIGS. 7A-C illustrate a cross-system 700 and method for positioning anelement in accordance with one embodiment of the disclosure. Thecross-system 700 may be fabricated using SUMMiT V™ and used postfabrication for rotation and precise 3-D positioning of rotated parts.As described above in connection with FIGS. 2A-H, the cross-system 700may be used, for example, for deploying micro-machinery with in-planerotating horizontal shafts and out-of-plane bearings formed around theshaft. As described above in connection with FIGS. 3A-E, thecross-system 700 method may also be used for post assemblingout-of-plane objects such as wheels to a “systems” platform. The methodmay be use for other suitable post fabrication assembly and processes.For example, the cross-system 700 may be used during operation of themicro machine 2 to rotate or otherwise move an element from or to acertain position or orientation in response to an input or event.Movement and rotation may comprise back and forth or other cyclingmovement or rotation of an element into and/or out of one or morepositions or orientations. As another example, during start-up orwake-up of the micro machine 2, one or more power, communication orother elements may be rotated or otherwise moved with the cross-system700 to a start-up or operational position and back to a rest positionwith the cross-system 700 after processing is complete or the micromachine 2 is powered down.

Referring to FIGS. 7A-B, a cross-system 700 is patterned in the SUMMiTV™ process with an “X” shaped structure 702 using P2 and P4 layers and acylinder 704 made up of layers P2, P3, and P4. When a force is appliedas shown, the P4 layer of the “X” structure 702 strikes the top of thecylinder 704 and the P2 layer strikes the bottom of the cylinder 704,inducing a moment on the cylinder 704, turning the top of the cylinder704 downward and the bottom of the cylinder 704 upward until thecylinder 704 has rotated ninety (90) degrees as shown in FIG. 7C. Ascylinder 704 is rotated, so is any connected structure 706.

For post assembly, a locking mechanism such as described above may beused alter rotation and deployment. For operational uses, the lockingmechanism may be omitted or may include a selectively releasable lock.For example, a double thermal actuator assembly such as thermal actuator410 illustrated in FIG. 4A may be used in connection with transmissionsystem 204 in FIGS. 2A and 2B, transmission system 550 in FIG. 5D ortransmission system 500 in FIGS. 5A and 5B to rotate an element back andforth.

FIGS. 8A-B illustrate a tweezers-system 800 and method for positioningan element in accordance with one embodiment of the disclosure. Thetweezers-system 800 may be fabricated using SUMMiT V™ and used postfabrication for rotation and precise 3-D positioning of rotated parts.The tweezers-system 800 may be use for other suitable post fabricationassembly and processes. For example, the tweezers-system 800 may be usedduring operation of the micro machine 2 to rotate or otherwise move anelement from or to a certain position or orientation in response to aninput or event. Movement and rotation may comprise movement or rotationof an element into and/or out of one or more positions or orientations.As another example, during start-up or wake-up of the micro machine 2,one or more power, communication or other elements may be rotated orotherwise moved with the tweezers-system 800 to a start-up oroperational position and back to a rest position after processing iscomplete or the micro machine 2 is powered down. Movement back may bedone by the use of springs and jacking system, such as the typesdescribed in connection with FIG. 10 or otherwise.

Referring to FIGS. 8A-B, tweezers-system 800 is patterned in the SUMMiTV™ process with a first prong 802 patterned in-plane using polysiliconlayer P4 and a second prong 804 patterned in-plane using polysiliconlayer P2. As the two prongs 802 and 804 of the tweezers are pulled inthe direction of the shown force, the prongs 802 and 804 are squeezedthrough a narrow gap 806 between fixed objects 808. As the prongs 802and 804 are squeezed together, prong 802 places a force on the P4 layerof the micro-wheel and prong 804 places a force on the P2 layer of themicro-wheel, creating a moment on the micro-size wheel which rotatesninety (90) degrees as the tweezers are pulled through the narrow gap806. As discussed above in connection with the micro vehicle 300, thecross-system 700 can also be used to deploy micro-wheels, but leaves the“T-shaped” cylinder piece which does not happen with the tweezers-system800.

FIGS. 9A-C illustrate a bearing system 900 and method in accordance withone embodiment of the disclosure. The bearing system 900 may be used forpost assembly bearing construction. In this embodiment, the bearing 900is fabricated using SUMMiT V™ and provides for precise 3-D positioningof rotated parts. As described above in connection with FIGS. 2A-H, thebearing 900 may be used, for example, for developing micro-machinerywith in-plane rotating horizontal shafts. The method may be use for orwith other suitable on-chip actuated, post assembly fabrication assemblyand processes.

Referring to FIGS. 9A-C, the bearing system 900 is patterned in theSUMMiT V™ process with one-half of the bearing patterned in structure902 which may be the polysilicon P4 layer and the other-half patternedin structure 904 which may be the polysilicon P2 layer. The shaft 906and alignment elements 908 may be patterned in the polysilicon P3 layer.After release of parts, on-chip actuated post assembly rotates the twostructures 902 and 904 with bearing halves ninety (90) degrees so thatthe two bearing halves (patterned in-plane) end up in an out-of-planeorientation and so that the two structures 902 and 904 and includedhalves encircle the shaft 906 and alignment elements 908 which have beenpatterned in the polysilicon P3 layer. For this, the P4 structure 902may be rotated downward ninety (90) degrees and the P2 structure 904 maybe rotated upward ninety (90) degrees, resulting in the out-of-planeorientation with both bearing halves fitting well together as depictedin FIG. 9C. In other embodiments, the bearing halves may be or otherwiseconfigured and rotated in the opposite directions with the P4 halfrotated upward and the P2 half rotated downward. In addition, differenttypes of structures may be fabricated on structures 902 and 904 andassembled or used in operation by rotation of the structures using thecross-system 700, tweezers-system 800 or other positioning system.

FIG. 10 illustrates a jacking system 1000 and method for positioning amicro or other movable element in accordance with one embodiment of thedisclosure. The jacking system 1000 may be used in connection withthermal actuators 1001 to perform on-chip actuated post assembly and/orto clear operational elements from post assembly structures. The jackingsystem 1000 may be omitted and post assembly performed with only thethermal actuators or with thermal actuators in connection with couplersor multipliers. In addition, the jacking system 1000 may be usedoperationally as part of the micro machine 2. For example, the jackingsystem 1000 may be extended in response to an input or event to performa function or to extend or retract a device to perform a function. Anypost fabrication post assembly system operable to move or rotate astructure may be used, such as the cross-system or tweezers-system.

Referring to FIG. 10, the jacking system 1000 may include a plunger1002, a cranking system 1004 for moving the plunger 1002, and a latchingsystem 1006 for holding the plunger 1002. The plunger 1002 ismechanically coupled to the cross-system 700, tweezers-system 800, orother post assembly or operational deployment system 1003.

The plunger 1002 may include one or more single, double or multiplesided racks of teeth 1008, or notches, for engagement by the crankingsystem 1004 and the latching system 1006. In a particular embodiment, afirst rack of teeth 1008 a may be engaged by the cranking system 1004. Asecond rack of teeth 1008 b may be engaged by the latching system 1006.

The cranking system 1004 is anchored to thermal actuators 1001. Thecranking system 1004 is coupled to the plunger 1002 by one or morecranking arms 1010 rotating about pivots 1016. The cranking arms 1010each include one or more teeth 1012 configured to engage teeth racks1008 a. The cranking arms 1010 may be biased toward the plunger 1002 bytension springs 1014. In one embodiment, the stiffness of the tensionsprings 1014 may be set based on the length of the tension spring 1014with the stiffness lessening as the length increases. In one embodiment,the cranking system 1004 may include slight protrusions 1030 to controlalignment and tolerance between the cranking system 1004 and the plunger1002. The tolerance, in a specific embodiment, may be fifty (50)nanometers. Also, as above, dimples may be used in to reduce friction asthe plunger 1002 and cranking system 1004 move and they may be used, forexample, to limit its vertical movement to several hundred nanometerstolerance.

The latching system 1006 is anchored to the substrate 1015. The latchingsystem 1006 is coupled to the plunger 1002 by one or more latching arms1020 rotating about pivots 1026. The latching arms 1020 each include oneor more teeth 1022 configured to engage teeth racks 1008 b. The latchingarms 1020 may be biased toward the plunger 1002 by tension springs 1024.The stiffness of the tension springs 1024 may be set based on the lengthof the tension spring 1024 with the stiffness lessening as the lengthincreases. In one embodiment, tension springs 1014 and 1024 may have thesame or substantially the same stiffness to provide balance between thecranking and latching elements.

In the SUMMiT V™ embodiment, the tension springs 1014 and 1024 may befabricated in the P3 layer without any attachment to the underlying P2layer except at its cantilevered end. In this embodiment, pivots 1016and 1026 may comprise a dimple extending below P3, for example, 1.7microns below P3 to within 0.3 microns above P2. A clearance of onemicron, for example, may be provided between each pivot 1016 or 1026 andthe surrounding socket 1032.

In operation, when the thermal actuators 1001 actuate, the cranking arms1010 push the plunger 1002 outward from deployment system 1003 where theplunger 1002 is prevented from reverse motion by the latching arms 1020.As the thermal actuators 1001 and cranking system 1004 return to theirrest positions, the latching arms 1020 continue to hold the plunger 1002in place. As the thermal actuators 1001 continue to be cycled, thecranking arms 1010 incrementally push the plunger 1002 outward one ormore teeth 1008 at a time on each power stroke, where the plunger 1002is incrementally held by the latching arms 1020. In this way, theelements can be, for example, incrementally moved out-of-plane oron-chip actuated post assembly structures incrementally moved clear ofor into operational engagement with operational elements.

Although this disclosure has been described in terms of certainembodiments and generally associated methods, alterations andpermutations of these embodiments and methods will be apparent to thoseskilled in the art. For example, any suitable element, including allthose specifically described above, may be rotated, slid, pushed,pulled, raised, lowered, or otherwise moved from in-plane toout-of-plane, from out-of-plane to in-plane, from in-plane to otherwisein-plane, from out-of-plane to otherwise out-of-plane, from any firstorientation to any second orientation. Such movement may move elementsinto or out of physical, electrical, or operational engagement orcommunication with other elements. In addition, movement may beoperational movement in addition to or in place of deployment movement.Accordingly, the above description of example embodiments does notdefine or constrain this disclosure. Other changes, substitutions, andalterations are also possible without departing from the spirit andscope of this disclosure.

What is claimed is:
 1. A method for engaging a micro element,comprising: fabricating a first micro component on a major surface of asubstrate, the first micro component in-plane with the major surface ofthe substrate, wherein the fabricating comprises: depositing thin filmson the major surface of the substrate; and patterning the deposited thinfilms in a form of the first component by removing excess material fromthe deposited thin films to produce the first micro component; movingthe first micro component into direct engagement with a second microcomponent in response to at least an input signal applied to a thirdmicro component coupled with the substrate; and wherein after the firstmicro component and second micro components are engaged, the secondmicro component is movable relative to the first micro component.
 2. Themethod of claim 1, further comprising rotating the first component intoengagement with the second component in response to the input.
 3. Themethod of claim 1, wherein the first micro structure comprises a bearingand the second micro structure comprises a rotational shaft.
 4. Themethod of claim 1, further comprising moving the first micro componentinto direct engagement with the second micro component using on-chipactuation in response to the input signal.